The IoT industry has been talking about integrated SIM for years. Now it is finally moving from theory to deployment. nuSIM IoT connectivity

Monogoto, known for its programmable hybrid connectivity platform, has announced a strategic cooperation with Nordic Semiconductor, a global leader in low-power wireless solutions. Together, they aim to accelerate the adoption of nuSIM, an integrated SIM approach from Redtea-Mobile, optimized specifically for IoT devices.

The headline is simple. But the implications are bigger than they look.

Monogoto and Nordic Semiconductor Launch Dedicated Partnership to Power the Future of Global Cellular + Satellite IoT.

This is not just another connectivity agreement. It is a structural shift in how IoT devices are designed, provisioned, and scaled globally.

Why nuSIM Matters Now

As IoT devices get smaller and more power-efficient, traditional SIM models are becoming outdated.

Removable SIM cards were built for a different era. They made sense when devices were larger, deployments were regional, and connectivity logistics could be handled manually. But the modern IoT landscape is different. Devices are deployed at a massive scale, often across borders, sometimes in remote or hostile environments. Swapping physical SIMs is not just inefficient. It can be impossible.

This is where nuSIM enters.

nuSIM is an integrated SIM technology embedded directly into the device module. Instead of inserting a plastic card or soldering a separate eSIM chip, connectivity credentials are integrated into the silicon design itself. It is leaner, more power-efficient, and far better suited for low-power IoT use cases.

Through this collaboration, Monogoto and Nordic Semiconductor are enabling nuSIM-ready designs embedded directly into the nRF9151 module. That means manufacturers can streamline production, improve security, and deliver global connectivity from day one without rethinking connectivity at the last minute.

From Hardware to Hybrid Connectivity

What makes this partnership particularly relevant is not just the integrated SIM angle. It is the hybrid connectivity model layered on top.

Monogoto is not only a cellular connectivity provider. It has positioned itself around programmable connectivity, including terrestrial cellular, satellite (NTN), and private network support. That hybrid capability aligns perfectly with the direction IoT is heading.

Devices increasingly need a fallback. Terrestrial cellular is not always available. Satellite coverage fills that gap. Add private networks into the mix, and you have a flexible architecture for industrial, logistics, environmental monitoring, and remote asset tracking deployments.

The collaboration allows Nordic Semiconductor customers to leverage Monogoto’s cellular, satellite (NTN), and private network connectivity as part of an integrated experience aligned with nuSIM principles. It is not connectivity as an afterthought. It is connectivity as architecture.

Developer Experience: Removing Friction Early

One of the most practical elements of this announcement is the Nordic nRF9151-SMA-DK development kit, which comes equipped with Monogoto connectivity.

That detail matters.

Too often, connectivity integration becomes a late-stage headache for IoT developers. SIM provisioning, roaming agreements, operator selection, and profile management add complexity during prototyping. With this setup, developers get immediate, hands-on access to globally optimized connectivity without dealing with physical SIM logistics or complicated provisioning workflows.

From prototype to pilot to production, friction is reduced.

As IoT ecosystems scale toward millions of devices, these early design decisions compound. Eliminating SIM handling and manual provisioning reduces operational overhead, speeds up time to market, and lowers deployment risk.

The Software-Defined Connectivity Shift

Maor Efrati, CTO at Monogoto, framed it clearly:

“nuSIM represents a fundamental shift in how IoT devices are designed, manufactured, and deployed. It is part of the Software-Defined Connectivity revolution. By removing the need for a physical SIM and enabling embedding connectivity directly into the module, we remove friction across the entire lifecycle, from prototyping to mass deployment—all without compromising on security. Our collaboration with Nordic is about growing an open, scalable ecosystem where this integrated SIM technology enables secure, low-power, and future-proof IoT connectivity across terrestrial and satellite networks.”

This is not marketing language. It reflects a broader industry direction.

Connectivity is increasingly software-defined. Operators, connectivity platforms, and hardware manufacturers are converging around programmable infrastructure rather than fixed provisioning models. The SIM, once a physical artifact, becomes a secure identity layer embedded within the device architecture.

For low-power IoT, that identity layer must also be energy efficient. Every microwatt matters. Removing external SIM components helps optimize board space and power consumption.

Silicon, Software, and the Cloud Converge

Kristian Sæther, Senior Product Director Long-Range at Nordic Semiconductor, emphasized integration:

“The future of IoT depends on tight integration between silicon, software, connectivity, and cloud. Integrated nuSIM allows companies to focus on innovation rather than SIM and connectivity logistics. By working with Monogoto, we’re giving our customers access to a global, reliable connectivity layer that complements Nordic’s low-power cellular solutions and supports the next generation of scalable IoT products.”

This statement captures the bigger picture.

The IoT stack is collapsing into a tighter ecosystem. Silicon vendors are no longer just chip providers. Connectivity providers are no longer just SIM resellers. Cloud platforms are no longer passive endpoints. Everything is interlinked.

If silicon, connectivity, and cloud are not aligned early, scalability suffers later.

By embedding nuSIM into the nRF9151 platform and pairing it with Monogoto’s hybrid network, Nordic and Monogoto are essentially pre-aligning those layers.

How This Compares to the Broader Market

Integrated SIM is not unique to nuSIM. The GSMA has long defined eSIM and iSIM frameworks, and several chipset vendors are exploring similar directions. Qualcomm, Sony, and other silicon players have invested in integrated SIM technologies. Meanwhile, hyperscalers are exploring tighter device-cloud provisioning models.

But what differentiates this move is the hybrid angle.

Many connectivity partnerships focus purely on terrestrial cellular. The explicit inclusion of satellite NTN support reflects the growing importance of non-terrestrial networks in IoT. According to industry reports from organizations such as GSMA Intelligence and ABI Research, satellite-enabled IoT is expected to grow significantly over the next decade as coverage gaps and resilience demands increase.

Hybrid connectivity is no longer a niche add-on. It is becoming foundational for global IoT deployments.

In addition, embedding connectivity directly into widely used development kits lowers the barrier for smaller developers and startups. That democratization effect should not be underestimated.

Why This Matters for Manufacturers

For device manufacturers, every additional component on a board increases cost, complexity, and potential failure points.

Integrated SIM reduces:

• Physical component count
• Supply chain dependencies
• Manufacturing steps
• Field servicing requirements

It also enhances security. Without a removable SIM, the attack surface is reduced. Secure credentials embedded in silicon are harder to tamper with than physical cards.

For industries such as utilities, logistics, agriculture, and industrial monitoring, where devices may operate unattended for years, this is critical.

The Bigger Picture for IoT

The IoT market is often described in terms of device volume. Billions of connected devices. Massive scale. Ultra-low power.

But scale alone is not the story.

Resilience is becoming just as important as scale. Hybrid coverage, satellite fallback, programmable connectivity, and embedded identity are all part of building resilient IoT infrastructures.

Monogoto and Nordic Semiconductor are positioning themselves at that intersection.

A Structural Shift, Not a Feature Update

This partnership signals more than a new development kit feature.

It reflects a structural change in how connectivity is delivered to IoT devices. Instead of treating SIMs as physical tools that get inserted at the end of the manufacturing line, connectivity becomes embedded at the silicon level and programmable at the platform level.

Compared to traditional MVNO models that still rely heavily on physical or soldered eSIM components, this approach pushes further toward full integration and lifecycle automation. As industry analysts from GSMA Intelligence and ABI Research continue to highlight, the future of IoT lies in scalable, remote, and software-driven provisioning models.

The companies that align silicon, connectivity, and cloud early will move faster and deploy at scale with fewer surprises.

In that context, the Monogoto and Nordic Semiconductor collaboration is not just a technical integration. It is a strategic alignment with where IoT is heading: embedded, hybrid, programmable, and globally accessible by design.

And in an industry that often moves slowly due to fragmentation and legacy systems, that kind of alignment is exactly what accelerates real adoption.