eSIM is taking the world of Connectivity and IoT by storm and as adoption gathers pace, China is opening the doors to eSIM usage and implementation and is predicted by many industry leaders to become the biggest market for eSIM in the coming years. It was in this context and under the banner of “Secure Connections, Unlimited Potential” that Giesecke+Devrient (G+D) delivered its first eSIM Summit in China bringing together industry experts and market leaders from China Unicom, Infineon, Quectel, MeiG Smart and GSMA Intelligence. ​G+D eSIM Summit China

Aiming at illuminating the transformative impact of eSIM the G+D eSIM Summit took place in Shenzhen on June 26, 2024. The event kicked off with a keynote from Dr. Philipp Schulte, CEO of G+D Mobile Security, in which he highlighted the profound impact eSIM technology is having and will have on all aspects of modern life. His insights emphasized the revolutionary potential of eSIM solutions and how this little piece of security technology is making the lives of billions more secure.

Following his keynote other experts across the full spectrum of the eSIM industry were invited on stage to deliver insightful speeches and interactive hands-on demonstrations, offering attendees the opportunity to engage directly with the technology and gain first-hand insights into its potential applications and benefits. With 120 attendees from 62 distinguished companies and organizations, the summit served as a vibrant platform for dialogue and partnership, featuring dynamic discussions on the latest trends, challenges, and opportunities in the eSIM landscape.

Pablo Iacopino, Director of Research and Business Content at GSMA Intelligence, brought a global perspective for eSIM, examining the new developments and trends that are shaping eSIM growth and innovation globally. Chen Hong, Director of Connectivity Hardware Products at G+D, building on this with a focus on the new GSMA SGP.32 standards and how G+D is interpreting the new features of eUICC, such as multiple active profiles, remote profile management, eUICC OS updates and Chinese encryption algorithms.

Industry experts from Infineon with its next-generation eSIM/SE technology based on the Tegrion system, Quectel and their advanced connectivity products which empower the IoT ecosystem and MeiG Smart cover domains such as FWA, smart cockpits, PCs and new retail, explored various beneficial aspects of eSIM technology. They highlighted that the eSIM with its advantages in form factor, high-security level, interoperability, and broad applicability is empowering everything from the creation of advanced chipset technology, enabling faster deployment, allowing for easier and more efficient support, reducing resource wastage in agriculture, and even leading to more flexible business models.

As the summit drew to an end, Philipp Schulte was on hand to comment: “As eSIM technology continues to gain momentum with G+D as a leader in this space, we remain dedicated to fostering innovation, supporting standardization efforts, and facilitating a seamless transition for businesses, embracing this new wave of digital transformation. This is the reason why we brought this eSIM Summit to China, with the top industry experts and meticulously curated agenda to continue to illustrate the transformative impacts of eSIM technology on IoT, focusing on its benefits in scalability, security, and operational efficiency.”

Xiaodong Zhang, Head of Connectivity & IoT Sales for China at G+D, also added: “As a company we have been active in China for 30 years. Not just in local production, but also deeply engaged in innovation and technology. We are proud to be able to host this great event here and the attendance of the top experts and market leaders really illustrates the growing interest and applicability of eSIM technology in IoT and beyond. We are thankful to all those who attended and participated with their valuable perspectives as these really enriched the summit’s discourse.“ G+D eSIM Summit China

Like this? "Sharing is caring!"